Elk Grove Village, IL 60007
sales@eiconnect.com
800-364-4844

PCB CAPABILITIES

PCB Board Attributes

Capabilities Attributes	Standard Capabilities Inch (mm); Tolerance
Minimum Line Width (Outer/Inner); (1/4 oz base Cu)
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (1/4 oz base Cu)
Minimum Line Width (Outer/Inner); (1/2 oz base Cu)	0.004" (0.102); +/- 20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (1/2 oz base Cu)	0.004" (0.102); +/- 20%
Minimum Line Width (Outer/Inner); (1 oz base Cu)	0.004" (0.102); +/- 20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (1 oz base Cu)	0.006" (0.152); +/-20%
Minimum Line Width (Outer/Inner); (2 oz base Cu)	0.006" (0.152); +/-20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (2 oz base Cu)	0.006" (0.152); +/-20%
Minimum Line Width (Outer/Inner); (3 oz base Cu)	0.008" (0.203); +/- 20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (3 oz base Cu)	0.008" (0.203); +/- 20%
Minimum Line Width (Outer/Inner); (4 oz base Cu)	0.010" (0.254); +/- 20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (4 oz base Cu)	0.010" (0.254); +/- 20%

Multilayer Capabilities

Capabilities Attributes	Standard Capabilities Inch (mm); Tolerance
Min. Thickness ( Inner Core)	0.002"
Min.Finish Line Width/Space	(1/1 oz) 3.5 /3.5 mil Inner (H/ H oz) 3/3 mil Outer 4/4 mil
Impedance Control L/W	Lower 4.0 mil (+/- 0.4 mil) Upper 4.1 mil (+/- 10%)
Non-Impedance Control L/W	+/- 20%
Min. Annular ring	4.0 mil for (general design) 3. 0 mil (for HDI)"
Min. Clearance	6. 0 mil
Dielec-Thickness Tolerance(Impedance)
Dielec-Thickness Tolerance(Non-Impedance)	No Criteria Restriction Request
ML Board Thickness Tolerance	< 20 mil +/- 2 mil (+/-10%) < 62 mil +/- 3 mil (+/-10%) > 62 mil +/- 7% (+/-10%)
Layer Registration (Core to Core)	< 0.002"
Warpage Tolerance	0.7 %
Etch back Specification (Class 3)	0.0002" ~ 0.002"
Internal Etch tolerance	+/-20%
External Etch tolerance	+/-20%
Layer to Layer Registration - (> 2 layer)	+/-0.003" (0.0762)
Layer to Layer Registration - (2 layer)	+/-0.002"(0.0508)
Maximum PWB Thickness (Mil)	137
Maximum Number of Layers	18
Profile Tolerance (Routed)	+/- 0.004" (0.1016)
Profile Tolerance (Scored)	+/-0.005" (0.127)
Minimum Internal Cut-out Radius	0.046" (1.168)
Smallest BGA footprint pitch - inches (mm)	0.032" (0.800)
I/L Copper to Board Edge (Routed) ^*2	0.010" (0.254)
I/L Copper to Board Edge (Scored) ^*2	0.020" (0.500)
O/L Copper to Board Edge (Routed) ^*2	0.008" (0.203)
O/L Copper to Board Edge (Scored) ^*2	0.020" (0.500)

Plating

Capabilities Attributes	Standard Capabilities Inch (mm); Tolerance
IPC-6012 Class 2	787 µin avg / 709 µin min (Through holes)
IPC-6012 Class 3
Military (MIL-PRF-31032)

Pad and Hole

Capabilities Attributes	Standard Capabilities Inch (mm); Tolerance
Minimum Finished PTH Hole Size	0.008 (0.203)
Component Finished PTH Size Tolerance	+/- 0.003"; 0.006" (0.152)
Press Fit application	:1
Via Finished PTH Size Tolerance	+/- 0.003"; 0.006" (0.152)
PTH Locational Tolerance	0.003" (0.076)
Internal Pad Size (Dia. over Drill)	0.012" (0.305)
Internal Anti-pad (Dia. over Drill)	0.016" (0.406)
External Pad Size (Dia. over Drill)	0.010" (0.254)

Drilling

Capabilities Attributes	Standard Capabilities Inch (mm); Tolerance
Smallest Mechanical Drill Size	0.008" (0.203)
Tolerance of Drill size	+/- 1 mil
Roughness for Hole wall	< 1.3 mil
Neil Head	< 2.0 x(Inner copper thickess)
Drill Quality	=IPC-A-600 class 2
Maximum Drill Aspect Ratio (w/ min. drill)	8:01
Maximum Micro via Aspect Ratio (Depth: Diameter)
Maximum Hole Size (Drilled)
Maximum Hole Size (Routed)
Thickness: < 0.020"" 0.031"" 0.062"" 0.093"" 0.125"""	"0.003"" '0.003"" '0.004"" '0.008"" '0.010"""
NPTH Size Tolerance Range	0.004" (1.102)
NPTH Locational Tolerance	0.003" (0.076)
Non-Plated Hole to Outer Copper Minimum Spacing	0.008" (0.203)
Hole to Inner Copper Minimum Spacing	0.016"
Non-Plated Hole to Edge (No Breakout)	0.030" (0.762)
Plated Hole to Edge (No Breakout)	0.040" (1.016)
Back Drilled Vias (High Speed Transitions)	No
Blind/Buried Vias (All Types)

HDI / Laser Micro Vias ⁽¹⁰⁾

Capabilities Attributes	Standard Capabilities Inch (mm); Tolerance
Laser vias smallest
Via aspect ratio
Landing and capture Pad size
Stack vias, Copper filled vias
Laser Drilled Vias

Control Depth Capabilities

Capabilities Attributes	Standard Capabilities Inch (mm); Tolerance
Drill depth Tolerance (Control Depth Drill Depth)	+/- 0.005"
Back Drill Dia (Minimum)
Drilled Hole over Finish (Dia)	0.010"

Fabrication

Capabilities Attributes	Standard Capabilities Inch (mm); Tolerance
V-score	Jump score: 200, 300 available Jump Min. length: 0.5""
Offset Tolerance Web Thickness Tolerance Positionn Tolerance	+/-0.005"
Average Web Thickness: Mininum Web thickness:	1/3 of thickness 1/4 of thickness
Router Bit (Standard)	0.093"; 0.062";
Router Tolerance (dia)	+/-0.008" (Std)
Router plated Slots	0.020"
Router Radius (Min)	0.031"

Bevel Capabilities

Capabilities Attributes	Standard Capabilities Inch (mm); Tolerance
Bevel Angles ; Depth Tolerance	200⁰, 300⁰ , 450⁰ available ; +/-0.005"

Soldar Mask

Capabilities Attributes	Standard Capabilities Inch (mm); Tolerance
Min. Solder Mask Dam (Green)	0.004" (0.102)
Registration (+/-) per side	0.003"
Mask to Copper clearance	0.003"
Peelable Solder mask	Min. 0.050" clearance
Solder mask Via plug w/LPI	80% min fill
NPTH holes/side	0.005"
Min. Mask defined pad diameter	0.005"
Carbon Ink
Solder mask Colors:	Green (Semi gloss); White (LED); Black, Blue, Red
Solder mask using Laser Direct Image	Yes
Non-Conductive Epoxy Via Fill ⁽³⁾
Conductive Via Fill ⁽¹⁰⁾

Silk Screen

Capabilities Attributes	Standard Capabilities Inch (mm); Tolerance
Inkjet silk screen	White only
LPI legend capabilities
Minimum line width	0.005"
LPI Legend Min. Line	0.003"
Serialization/Bar code	Yes
Silk screen clearance Copper pad	0.005"

Impedance (Adder)

Capabilities Attributes	Standard Capabilities Inch (mm); Tolerance
Single ended; Differential Edge-coupled ; Differential Broadside-Coupled	+/- 10%
Inhouse testing	Polar TDR or Microcraft

Technology:

Capabilities Attributes	Standard Capabilities Inch (mm); Tolerance
Etch Back; Edge plating; Castellated Holes; Milling;

Materials

Capabilities Attributes	Standard Capabilities Inch (mm); Tolerance
Minimum Dielectric Thickness	0.003 (0.076)
Minimum Copper Weight - Inner Layers (oz)	0.5
Minimum Starting Copper Weight - Outer Layers (oz)	0.025
Maximum Copper Weight - Inner Layers (oz)	3
Maximum Starting Copper Weight - Outer Layers (oz)	3
Epoxy Glass (140C Tg min)	Yes
Epoxy Glass (170C Tg min)	Yes
Polyimide Glass (9)	Yes
Resin Coated Copper (for HDI)	No
GeTek ⁽⁹⁾	Yes
Isola 408 / Isola 408HR	Yes
Isola ISpeed(9) / Isola ITera ⁽⁹⁾	Yes
Hitachi GHA-679G (Theta) ⁽⁹⁾/td>	Yes
Rogers(9) 4003/4403 Rogers⁽⁹⁾ 4350B/4450B Rogers⁽⁹⁾ 4533	No
Teflons⁽⁹⁾ (Rogers 6002, 6010, 5880) Halogen Free Epoxies⁽⁹⁾	No
Buried Capacitance (Faradflex)	No
Aluminum MCB	Yes

Multilayer Stackup Tolerances

Capabilities Attributes	Standard Capabilities Inch (mm); Tolerance
Thickness: <0.020"" 0.031"" 0.062"" 0.093"" 0.125""	STANDARD +/-0.005"" SPECIAL +/-0.003"" STANDARD +/-0.005"" SPECIAL +/-0.003"" STANDARD +/-0.006"" SPECIAL +/-0.003"" STANDARD +/-0.009"" SPECIAL +/-0.006"" STANDARD +/-0.012"" SPECIAL +/-0.009"""

Surface Finishes (Adder)

Capabilities Attributes	Standard Capabilities Inch (mm); Tolerance
Lead-free HASL; HASL ⁽¹⁰⁾	Coverage and solderable (30-1000μin) C: SN100C; (HASL): RoHS S: IPC-6012
Electroless Nickel Immersion Gold (ENIG)	Def. Range: Ni:118μin min / Au:2-5μin C: Uyumerra S: IPC-4552
Eless Nickel Eless Palladium Imm Gold (ENEPIG) ⁽¹⁰⁾	Ni:118μin min / Pd:2-5μin / Au:1-2μin V: Superior Processing S: IPC-4552 (Ni/Au), ASTM-B-679 (Pd)
Hard Gold ⁽¹⁰⁾	v Flash Au: 5-15μin/Contact pads: 30μin V: Superior Processing S: ASTM-B-488
Hard Gold (Tabs)	Default Range: Ni:118μin min / Au:30μin S: ASTM-B-488
Soft Bondable Gold ⁽¹⁰⁾	Range: Ni:118μin min / Au:50μin min V: Superior Processing
Immersion Silver	Range: 6 - 18μin C: Uyumerra Silver S: IPC-4553
Mix Finishes (ENIG and Soft Gold)	Yes

Multiple Finish (Adder)

Capabilities Attributes	Standard Capabilities Inch (mm); Tolerance
HASL with selective gold	Yes
ENIG w/ Au fingers	Yes
Recessed Fingers	Yes

Electrical Test Capabilities

Capabilities Attributes	Standard Capabilities Inch (mm); Tolerance
TDR Test Tolerances	0.1
HiPot Test (AC/DC) ⁽¹⁰⁾	Yes
Min. Test Continuity	0.1 Ohms
Max. Test Voltage	500 V
Max. Test Isolated resistance	25 Mohm-2Gohm
Fixture (Pad size)	0.020"
Flying Probe (pad size:)	0.010"
DC line Resistance Testing	Yes

Quality

IPC-6012 Class 1
IPC-6012 Class 2
IPC-6012 Class 3 (High Reliability)
IPC-6012 Class 3A (Space & Military Avionics)
Quality Reports
AS 9100 report (Full FAIR)	Complete FAIR report with Form 1: Part Number Accountability and Form 3: Characteristic Accountability, Verification and Compatibility Evaluation. Material C of C are included
FAI Report (Partial)	Partial FAIR; Form 3: Characteristic Accountability, Verification and Compatibility Evaluation without NC; Material C of C are NOT included
Cross-section report (IPC 9241)	Failure analysis (Outside Service): - Optical inspection and documentation with Real time, high resolution x-ray inspection. - Cross-sectioning per IPC 9241, Optical and SEM imaging and documentation, Formal, final report
Cross-section report (Inhouse)	Measurements only; - Hole Cu thickness - Surface Cu Thickness - Thermal Stress @ 288 +/- 5 C - Dielectric Thikness
C of C (Std)	Material, Final finish, Date code info.
Adv. C of C	Std C of C and additional data - Electrical Test data - Shipment with Lot # or Date code details - Product Details
XRF Report	Measurements - Average thickness analysis - Detail Metal thickess analysis
Solderbility Report	Test Method J-Std 003 3.5.1
Thermal Stress Report	IPC-TM-650 2.6.8
Hi Pot Test	Measurements only
TDR report (MOV)	Measurements only
Ionic Cont. Report	Test results only
4 POINT Kevin test	Measurements only
Capacitance report	Measurements only
Resistance Value report	Measurements only

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PCB Board Attributes

Capabilities Attributes	Extended Capabilities Inch (mm); Tolerance
Minimum Line Width (Outer/Inner); (1/4 oz base Cu)	0.0025" (0.064); +/-20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (1/4 oz base Cu)	0.003" (0.076); +/-20%
Minimum Line Width (Outer/Inner); (1/2 oz base Cu)	0.004" (0.102); +/- 20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (1/2 oz base Cu)	0.005" (0.127); +/-20%
Minimum Line Width (Outer/Inner); (1 oz base Cu)	0.005" (0.127); +/-20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (1 oz base Cu)	0.006" (0.152); +/-20%
Minimum Line Width (Outer/Inner); (2 oz base Cu)	0.006" (0.152); +/-20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (2 oz base Cu)	0.007" (0.178); +/-20%
Minimum Line Width (Outer/Inner); (3 oz base Cu)	0.008" (0.203); +/- 20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (3 oz base Cu)	0.009" (0.228); +/-20%
Minimum Line Width (Outer/Inner); (4 oz base Cu)	0.011" (0.279); +/- 20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (4 oz base Cu)	0.013" (0.330); +/-20%

Multilayer Capabilities

Capabilities Attributes	Extended Capabilities Inch (mm); Tolerance
Min. Thickness ( Inner Core)
Min.Finish Line Width/Space
Inner
Min. Finish Line Width / Space
Impedance Control L/W
Non-Impedance Control L/W
Min. Annular ring
Min. Clearance
Dielec-Thickness Tolerance(Impedance)
Dielec-Thickness Tolerance(Non-Impedance)
ML Board Thickness Tolerance
Layer Registration (Core to Core)
Warpage Tolerance
Etch back Specification (Class 3)
Internal Etch tolerance	+/-20%
External Etch tolerance	+/-20%
Layer to Layer Registration - (> 2 layer)
Layer to Layer Registration - (2 layer)
Maximum PWB Thickness (Mil)	210
Maximum Number of Layers	24
Profile Tolerance (Routed)	+/- 0.005" (0.127)
Profile Tolerance (Scored)	+/-0.005" (0.127)
Minimum Internal Cut-out Radius	0.032" (0.813)
Smallest BGA footprint pitch - inches (mm)	0.020" (0.500)
I/L Copper to Board Edge (Routed) ^*2	0.007" (0.178)
I/L Copper to Board Edge(Routed) ^*2	0.015" (0.381)
O/L Copper to Board Edge(Routed) ^*2	0.005" (0.127)
O/L Copper to Board Edge(Routed) ^*2	0.012" (0.305)

Plating

Capabilities Attributes	Extended Capabilities Inch (mm); Tolerance
IPC-6012 Class 2
IPC-6012 Class 3	984 µin avg / 787µin min (Through holes)
Military (MIL-PRF-31032)	1000 µin min (Through holes)

Pad and Hole

Capabilities Attributes	Extended Capabilities Inch (mm); Tolerance
Minimum Finished PTH Hole Size	0.005" (0.127)
Component Finished PTH Size Tolerance	+/- 0.002"; 0.004" (0.102)
Press Fit application	+/- 0.002"
Via Finished PTH Size Tolerance	+/- 0.002"; 0.004" (0.102)
PTH Locational Tolerance	N/A
Internal Pad Size (Dia. over Drill)	0.008" (0.203)
Internal Anti-pad (Dia. over Drill)	0.012" (0.305)
External Pad Size (Dia. over Drill)	0.006" (0.152)

Drilling

Capabilities Attributes	Extended Capabilities Inch (mm); Tolerance
Smallest Mechanical Drill Size	0.006" or less
Tolerance of Drill size
Roughness for Hole wall
Neil Head
Drill Quality
Maximum Drill Aspect Ratio (w/ min. drill)	12:1
Maximum Micro via Aspect Ratio (Depth: Diameter)
Maximum Hole Size (Drilled)
Maximum Hole Size (Routed)
Thickness: < 0.020"" 0.031"" 0.062"" 0.093"" 0.125""
NPTH Size Tolerance Range
NPTH Locational Tolerance
NPTH to Outer Copper Minimum Spacing
Hole to Inner Copper Minimum Spacing
NPTH to Edge (No Breakout)
Plated Hole to Edge (No Breakout)
Back Drilled Vias (High Speed Transitions)
Blind/Buried Vias (All Types)	Yes

HDI / Laser Micro Vias ⁽¹⁰⁾

Capabilities Attributes	Extended Capabilities Inch (mm); Tolerance
Laser vias smallest	0.004" (0.1016)
Via aspect ratio	1:1
Landing and capture Pad size	via + 0.008"
Stack vias, Copper filled vias	Yes
Laser Drilled Vias	Yes (Outside service)

Control Depth Capabilities

Capabilities Attributes	Extended Capabilities Inch (mm); Tolerance
Drill depth Tolerance (Control Depth Drill Depth)
Back Drill Dia (Minimum)	0.014"
Drilled Hole over Finish (Dia)

Fabrication

Capabilities Attributes	Extended Capabilities Inch (mm); Tolerance
V-score
Offset Tolerance Web Thickness Tolerance Positionn Tolerance
Average Web Thickness: Mininum Web thickness:
Router Bit (Standard)	0.031" and '0.022"
Router Tolerance (dia)	+/-0.003"
Router plated Slots	0.008" (Min)
Router Radius (Min)	0.0105"

Bevel Capabilities

Capabilities Attributes	Extended Capabilities Inch (mm); Tolerance
Bevel Angles ; Depth Tolerance

Soldar Mask

Capabilities Attributes	Extended Capabilities Inch (mm); Tolerance
Min. Solder Mask Dam (Green)	0.003" (0.076)
Registration (+/-) per side	0.0025"
Mask to Copper clearance	Min. 0.002" (LDI)
Peelable Solder mask	Min. 0.040"
Solder mask Via plug w/LPI
NPTH holes/side
Min. Mask defined pad diameter
Carbon Ink	YES
Solder mask Colors:	Any custom color
Solder mask using Laser Direct Image
Non-Conductive Epoxy Via Fill ⁽³⁾	Yes
Conductive Via Fill ⁽¹⁰⁾	Yes

Silk Screen

Capabilities Attributes	Extended Capabilities Inch (mm); Tolerance
Inkjet silk screen
LPI legend capabilities	Black, Yellow, Red, Blue
Minimum line width
LPI Legend Min. Line
Serialization/Bar code
Silk screen clearance Copper pad

Impedance (Adder)

Capabilities Attributes	Extended Capabilities Inch (mm); Tolerance
Single ended; Differential Edge-coupled ; Differential Broadside-Coupled
Inhouse testing

Techonology

Capabilities Attributes	Extended Capabilities Inch (mm); Tolerance
Etch Back; Edge plating; Castellated Holes; Milling;	Yes

Materials

Capabilities Attributes	Extended Capabilities Inch (mm); Tolerance
Minimum Dielectric Thickness	0.0025" (0.064)
Minimum Copper Weight - Inner Layers (oz)	0.25
Minimum Starting Copper Weight - Outer Layers (oz)	0.25
Maximum Copper Weight - Inner Layers (oz)	4
Maximum Starting Copper Weight - Outer Layers (oz)	5
Epoxy Glass (140C Tg min)	Yes
Epoxy Glass (170C Tg min)	Yes
Polyimide Glass (9)	Yes
Resin Coated Copper (for HDI)
GeTek ⁽⁹⁾	No
Isola 408 / Isola 408HR	Yes
Isola ISpeed(9) / Isola ITera ⁽⁹⁾	Yes
Hitachi GHA-679G (Theta) ⁽⁹⁾/td>	Yes
Rogers(9) 4003/4403 Rogers⁽⁹⁾ 4350B/4450B Rogers⁽⁹⁾ 4533	Yes
Teflons⁽⁹⁾ (Rogers 6002, 6010, 5880) Halogen Free Epoxies⁽⁹⁾	Yes
Buried Capacitance (Faradflex)	Yes
Aluminum MCB	Yes

Multilayer Stackup Tolerances

Capabilities Attributes	Extended Capabilities Inch (mm); Tolerance
Thickness: <0.020"" 0.031"" 0.062"" 0.093"" 0.125""

Surface Finishes (Adder)

Capabilities Attributes	Extended Capabilities Inch (mm); Tolerance
Lead-free HASL; HASL ⁽¹⁰⁾
Electroless Nickel Immersion Gold (ENIG)
Eless Nickel Eless Palladium Imm Gold (ENEPIG) ⁽¹⁰⁾
Hard Gold ⁽¹⁰⁾
Hard Gold (Tabs)
Soft Bondable Gold ⁽¹⁰⁾
Immersion Silver
Mix Finishes (ENIG and Soft Gold)

Multiple Finish (Adder)

Capabilities Attributes	Extended Capabilities Inch (mm); Tolerance
HASL with selective gold	Yes
ENIG w/ Au fingers	Yes
Recessed Fingers	Yes

Electrical Test Capabilities

Capabilities Attributes	Extended Capabilities Inch (mm); Tolerance
TDR Test Tolerances	0.05
HiPot Test (AC/DC) ⁽¹⁰⁾
Min. Test Continuity
Max. Test Voltage
Max. Test Isolated resistance
Fixture (Pad size)
Flying Probe (pad size:)	0.008"
DC line Resistance Testing

Quality

IPC-6012 Class 1
IPC-6012 Class 2
IPC-6012 Class 3 (High Reliability)
IPC-6012 Class 3A (Space & Military Avionics)
Quality Reports
AS 9100 report (Full FAIR)	Yes
FAI Report (Partial)	Yes
Cross-section report (IPC 9241)	Yes
Cross-section report (Inhouse)	Yes
C of C (Std)	Yes
Adv. C of C	Yes
XRF Report	Yes
Solderbility Report	Yes
Thermal Stress Report	Yes
Hi Pot Test	Yes
TDR report (MOV)	Yes
Ionic Cont. Report	Yes
4 POINT Kevin test	Yes
Capacitance report	Yes
Resistance Value report	Yes

CLIENT TESTIMONIALS

"We are pleased to say that EIC is the ONLY supplier we use to manufacture the printed circuit boards for our surge protection equipment since last 8 years. From quality, to price, to turn-time, Electronic Interconnect Corporation does an excellent job."

T.A Vice President

Electronic Interconnect does an excellent job!

"Electronic Interconnect has been one of our approved suppliers for almost 20 years. Their level of dedication and response to our needs has made them one of our top performing suppliers. The quality standards at EI exceed those of their competition which we have tried in the past."

D.M V.P

Their level of dedication and response to our needs has made them one of our top performing suppliers

"Customer Satisfaction levels are excellent and consistent progress is noted in meeting the quality objectives. Top Management, Quality Manager and all the staff in the company have an effective approach to continual improvement. This is probably one of the few companies that has always been seeking to improve, year after year"

Quality Auditor

One of the few companies that has always been seeking to improve, year after year

" We wish to thank EI for continued excellence in products and customer service since last 7 years. EI’s ability to provide Quick turns, a variety of options, and consistent attention to detail is something we know we can depend on."

D.H Hangstrom Electronics

EI’s ability to provide Quick turn and consistent attention to detail is something we know we can depend on

" I would like to take this opportunity to thank E.I. for superb customer service as well as excellent quality. E.I. always delivers excellent responsiveness from all departments."

A.D Artisan Control Group

Superb customer service as well as excellent quality

" You are always professional, on time, and provide a solid product at a fair price. And your process catches many errors before fabrication even starts "

Capabilities / PCB Capabilities

PCB Manufacturing Capabilities

PCB CAPABILITIES

PCB Board Attributes

Multilayer Capabilities

Plating

Pad and Hole

Drilling

HDI / Laser Micro Vias (10)

Control Depth Capabilities

Fabrication

Bevel Capabilities

Soldar Mask

Silk Screen

Impedance (Adder)

Technology:

Materials

Multilayer Stackup Tolerances

Surface Finishes (Adder)

Multiple Finish (Adder)

Electrical Test Capabilities

Quality

Quality Reports

PCB Board Attributes

Multilayer Capabilities

Plating

Pad and Hole

Drilling

HDI / Laser Micro Vias (10)

Control Depth Capabilities

Fabrication

Bevel Capabilities

Soldar Mask

Silk Screen

Impedance (Adder)

Techonology

Materials

Multilayer Stackup Tolerances

Surface Finishes (Adder)

Multiple Finish (Adder)

Electrical Test Capabilities

Quality

Quality Reports

CLIENT TESTIMONIALS

Quick Links

Sustainability Complaince

Shipping Info

PCB Manufacturing
Capabilities

HDI / Laser Micro Vias ⁽¹⁰⁾

HDI / Laser Micro Vias ⁽¹⁰⁾