PCB Manufacturing Capabilities

We are committed to providing the highest-quality circuit boards in the industry. To ensure this , we maintain a variety of certications.

PCB Capabilities

PCB Board Attributes

Capabilities Attributes Standard Capabilities Inch (mm); Tolerance
Minimum Line Width (Outer/Inner); (1/4 oz base Cu)
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (1/4 oz base Cu)
Minimum Line Width (Outer/Inner); (1/2 oz base Cu) 0.004″ (0.102); +/- 20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (1/2 oz base Cu) 0.004″ (0.102); +/- 20%
Minimum Line Width (Outer/Inner); (1 oz base Cu) 0.004″ (0.102); +/- 20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (1 oz base Cu) 0.006″ (0.152); +/-20%
Minimum Line Width (Outer/Inner); (2 oz base Cu) 0.006″ (0.152); +/-20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (2 oz base Cu) 0.006″ (0.152); +/-20%
Minimum Line Width (Outer/Inner); (3 oz base Cu) 0.008″ (0.203); +/- 20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (3 oz base Cu) 0.008″ (0.203); +/- 20%
Minimum Line Width (Outer/Inner); (4 oz base Cu) 0.010″ (0.254); +/- 20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (4 oz base Cu) 0.010″ (0.254); +/- 20%

Silk Screen

Capabilities Attributes Standard Capabilities Inch (mm); Tolerance
Inkjet silk screen White Only
LPI legend capabilities
Minimum line width 0.005″
LPI Legend Min. Line 0.003″
Serialization/Bar code Yes
Silk screen clearance Copper pad 0.005″

Multilayer Capabilities

Capabilities Attributes Standard Capabilities Inch (mm); Tolerance
Min. Thickness ( Inner Core) 0.002″
Min.Finish Line Width/Space (1/1 oz) 3.5 /3.5 mil
Inner (H/ H oz) 3/3 mil
Outer 4/4 mil
Impedance Control L/W Lower 4.0 mil (+/- 0.4 mil)
Upper 4.1 mil (+/- 10%)
Non-Impedance Control L/W +/- 20%
Min. Annular ring 4.0 mil (general design)
3.0 mil (for HDI)
Min. Clearance 6.0 mil
Dielec-Thickness Tolerance (Impedance) Request
Dielec-Thickness Tolerance (Non-Impedance) No Criteria Restriction
ML Board Thickness Tolerance < 20 mil +/- 2 mil (+/-10%)
< 62 mil +/- 3 mil (+/-10%)
> 62 mil +/- 7% (+/-10%)
Layer Registration (Core to Core) < 0.002″
Warpage Tolerance 0.7 %
Etch back Specification (Class 3) 0.0002″ ~ 0.002″
Internal Etch tolerance +/- 20%
External Etch tolerance +/- 20%
Layer to Layer Registration – (> 2 layer) +/- 0.003″ (0.0762)
Layer to Layer Registration – (2 layer) +/- 0.002″ (0.0508)
Maximum PWB Thickness (Mil) 137
Maximum Number of Layers 18
Profile Tolerance (Routed) +/- 0.004″ (0.1016)
Profile Tolerance (Scored) +/- 0.005″ (0.127)
Minimum Internal Cut-out Radius 0.046″ (1.168)
Smallest BGA footprint pitch – inches (mm) 0.032″ (0.800)
I/L Copper to Board Edge (Routed) *2 0.010″ (0.254)
I/L Copper to Board Edge (Scored) *2 0.020″ (0.500)
O/L Copper to Board Edge (Routed) *2 0.008″ (0.203)
O/L Copper to Board Edge (Scored) *2 0.020″ (0.500)

Plating

Attribute Specification
IPC-6012 Class 2 787 µin avg / 709 µin min (Through holes)
IPC-6012 Class 3 -
Military (MIL-PRF-31032) -

Pad and Hole

Capabilities Attributes Standard Capabilities Inch (mm); Tolerance
Minimum Finished PTH Hole Size
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (1/4 oz base Cu) 0.008″ (0.203)
Component Finished PTH Size Tolerance +/- 0.003″; 0.006″ (0.152)
Press Fit Application 1
Via Finished PTH Size Tolerance +/- 0.003″; 0.006″ (0.152)
PTH Locational Tolerance 0.003″ (0.076)
Internal Pad Size (Dia. over Drill) 0.012″ (0.305)
Internal Anti Size (Dia. over Drill) 0.016″ (0.406)
External Pad Size (Dia. over Drill) 0.010″ (0.254)

Drilling

Capabilities Attributes Standard Capabilities Inch (mm); Tolerance
Smallest Mechanical Drill Size 0.008″ (0.203)
Tolerance of Drill size +/- 1 mil
Roughness for hole wall < 1.3 mil
Neil Head < 2.0 x (Inner copper thickness)
Drill Quality = IPC-A-600 class 2
Maximum Drill Aspect Ratio (w/ min. drill) 8:01
Maximum Micro via Aspect Ratio (Depth: Diameter) --
Maximum Hole Size (Drilled) --
Maximum Hole Size (Routed) --
Thickness:
  • < 0.020″: 0.003″
  • 0.031″: 0.003″
  • 0.062″: 0.004″
  • 0.093″: 0.008″
  • 0.125″: 0.010″
NPTH Size Tolerance Range 0.004″ (1.102)
NPTH Locational Tolerance 0.003″ (0.076)
Non-Plated Hole to Outer Copper Minimum Spacing 0.008″ (0.203)
Hole to Inner Copper Minimum Spacing 0.016″
Non-Plated Hole to Edge (No Breakout) 0.030″ (0.762)
Plated Hole to Edge (No Breakout) 0.040″ (1.016)
Back Drilled Vias (High Speed Transitions) NO
Blind/Buried Vias (All Types) --

HDI / Laser Micro Vias (10)

Capabilities Attributes Standard Capabilities Inch (mm); Tolerance
Laser Vias Smallest --
Via Aspect Ratio --
Landing and Capture Pad Size --
Stack Vias, Copper Filled Vias --
Laser Drilled Vias --

Control Depth Capabilities

Capabilities Attributes Standard Capabilities Inch (mm); Tolerance
Drill depth Tolerance (Control Depth Drill Depth) +/- 0.005″
Back Drill Dia (Minimum) --
Drilled Hole over Finish (Dia) 0.010″

Fabrication

Capabilities Attributes Standard Capabilities Inch (mm); Tolerance
V-Score Jump Score: 200, 300 available; Jump Min. Length: 0.5″
Offset Tolerance --
Web Thickness Tolerance --
Position Tolerance +/- 0.005″
Average Web Thickness --
Minimum Web Thickness 1/3 of thickness; 1/4 of thickness
Router Bit (Standard) 0.093″; 0.062″
Router Tolerance (Dia) +/- 0.008″ (Std)
Router Plated Slots 0.020″
Router Radius (Min) 0.031″

Bevel Capabilities

Capabilities Attributes Standard Capabilities Inch (mm); Tolerance
Bevel Angles ; Depth Tolerance 2000, 3000 , 4500 available ; +/-0.005″

Solder Mask

Capabilities Attributes Standard Capabilities Inch (mm); Tolerance
Min. Solder Mask Dam (Green) 0.004″ (0.102)
Registration (+/-) per side 0.003″
Mask to Copper Clearance 0.003″
Peelable Solder Mask Min. 0.050″ clearance
Solder Mask Via Plug w/ LPI 80% min fill
NPTH Holes/Side 0.005″
Min. Mask Defined Pad Diameter 0.005″
Carbon Link --
Solder Mask Colors Green (Semi gloss); White (LED); Black, Blue, Red
Solder Mask Using Laser Direct Image Yes
Non-Conductive Epoxy Via Fill --
Conductive Via Fill --

Impedance (Adder)

Capabilities Attributes Standard Capabilities Inch (mm); Tolerance
Single ended; Differential Edge-coupled ; Differential Broadside-Coupled +/- 10%
Inhouse testing Polar TDR or Microcraft

Technology

Capabilities Attributes Standard Capabilities Inch (mm); Tolerance
Etch Back; Edge plating; Castellated Holes; Milling; --

Materials

Capabilities Attributes Standard Capabilities Inch (mm); Tolerance
Minimum Dielectric Thickness 0.003 (0.076)
Minimum Copper Weight – Inner Layers (oz) 0.5
Minimum Starting Copper Weight – Outer Layers (oz) 0.025
Maximum Copper Weight – Inner Layers (oz) 3
Maximum Starting Copper Weight – Outer Layers (oz) 3
Epoxy Glass (140C Tg min) Yes
Epoxy Glass (170C Tg min) Yes
Polyimide Glass (9) Yes
Resin Coated Copper (for HDI) No
GeTek (9) Yes
Isola 408 / Isola 408HR Yes
Isola ISpeed(9) / Isola ITera (9) Yes
Hitachi GHA-679G (Theta) (9) Yes
Rogers(9) 4003/4403 Rogers(9) 4350B/4450B Rogers(9) 4533 No
Teflons(9) (Rogers 6002, 6010, 5880) Halogen Free Epoxies(9) No
Buried Capacitance (Faradflex) No
Aluminum MCB Yes

Multilayer Stackup Tolerances

Capabilities Attributes Standard Capabilities Inch (mm); Tolerance
Thickness:
0.020″”
0.031″”
0.062″”
0.093″”
0.125″” 		STANDARD +/-0.005″” SPECIAL +/-0.003″”
STANDARD +/-0.005″” SPECIAL +/-0.003″”
STANDARD +/-0.006″” SPECIAL +/-0.003″”
STANDARD +/-0.009″” SPECIAL +/-0.006″”
STANDARD +/-0.012″” SPECIAL +/-0.009″””

Surface Finishes (Adder)

Capabilities Attributes Standard Capabilities Inch (mm); Tolerance
Lead-free HASL; HASL (10) Coverage and solderable (30-1000μin)
C: SN100C; (HASL): RoHS
S: IPC-6012
Electroless Nickel Immersion Gold (ENIG) Def. Range: Ni:118μin min / Au:2-5μin
C: Uyumerra
S: IPC-4552
Electroless Nickel Electroless Palladium Imm Gold (ENEPIG) (10) Ni:118μin min / Pd:2-5μin / Au:1-2μin
V: Superior Processing
S: IPC-4552 (Ni/Au), ASTM-B-679 (Pd)
Hard Gold (10) v Flash Au: 5-15μin/Contact pads: 30μin
V: Superior Processing
S: ASTM-B-488
Hard Gold (Tabs) Default Range: Ni:118μin min / Au:30μin S: ASTM-B-488
Soft Bondable Gold (10) Range: Ni:118μin min / Au:50μin min V: Superior Processing
Immersion Silver Range: 6 – 18μin
C: Uyumerra Silver
S: IPC-4553
Mix Finishes (ENIG and Soft Gold) Yes

Multiple Finishes (Adder)

Capabilities Attributes Standard Capabilities Inch (mm); Tolerance
HASL with selective gold Yes
ENIG w/ Au fingers Yes
Recessed Fingers Yes

Electrical Test Capabilities

Capabilities Attributes Standard Capabilities Inch (mm); Tolerance
TDR Test Tolerances 0.1
HiPot Test (AC/DC) (10) Yes
Min. Test Continuity 0.1 Ohms
Max. Test Voltage 500 V
Max. Test Isolated resistance 25 Mohm-2Gohm
Fixture (Pad size) 0.020″
Flying Probe (pad size) 0.010″

Quality

Capabilities Attributes Standard Capabilities Inch (mm); Tolerance
IPC-6012 Class 1 --
IPC-6012 Class 2 --
IPC-6012 Class 3 (High Reliability) --
IPC-6012 Class 3A (Space & Military Avionics) --
Quality Reports --
AS 9100 report (Full FAIR) Complete FAIR report with Form 1: Part Number Accountability and Form 3: Characteristic Accountability, Verification and Compatibility Evaluation. Material C of C are included
FAI Report (Partial) Partial FAIR; Form 3: Characteristic Accountability, Verification and Compatibility Evaluation without NC; Material C of C are NOT included
Cross-section report (IPC 9241) Failure analysis (Outside Service):
- Optical inspection and documentation with Real time, high resolution x-ray inspection.
- Cross-sectioning per IPC 9241, Optical and SEM imaging and documentation, Formal, final report
Cross-section report (Inhouse) Measurements only;
- Hole Cu thickness
- Surface Cu Thickness
- Thermal Stress @ 288 +/- 5 C
- Dielectric Thickness
C of C (Std) Material, Final finish, Date code info.
Adv. C of C Std C of C and additional data
- Electrical Test data
- Shipment with Lot # or Date code details
- Product Details
XRF Report Measurements
- Average thickness analysis
- Detail Metal thickness analysis
Solderbility Report Test Method J-Std 003 3.5.1
Thermal Stress Report IPC-TM-650 2.6.8
Hi Pot Test Measurements only
TDR report (MOV) Measurements only
Ionic Cont. Report Test Results only
4 POINT Kevin test Measurements only
Capacitance report Measurements only
Resistance Value report Measurements only

Technology

Capabilities Attributes Extended Capabilities Inch (mm); Tolerance
Etch Back; Edge plating; Castellated Holes; Milling; Yes

Quality

Capabilities Attributes Extended Capabilities Inch (mm); Tolerance
IPC-6012 Class 1 --
IPC-6012 Class 2 --
IPC-6012 Class 3 (High Reliability) --
IPC-6012 Class 3A (Space & Military Avionics) --
Quality Reports --
AS 9100 report (Full FAIR) Yes
FAI Report (Partial) Yes
Cross-section report (IPC 9241) Yes
Cross-section report (Inhouse) Yes
C of C (Std) Yes
Adv. C of C Yes
XRF Report Yes
Solderbility Report Yes
Thermal Stress Report Yes
Hi Pot Test Yes
TDR report (MOV) Yes
Ionic Cont. Report Yes
4 POINT Kevin test Yes
Capacitance report Yes
Resistance Value report Yes

PCB Board Attributes

Capabilities Attributes Extended Capabilities Inch (mm); Tolerance
Minimum Line Width (Outer/Inner); (1/4 oz base Cu) 0.0025″ (0.064); +/-20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (1/4 oz base Cu) 0.003″ (0.076); +/-20%
Minimum Line Width (Outer/Inner); (1/2 oz base Cu) 0.004″ (0.102); +/- 20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (1/2 oz base Cu) 0.005″ (0.127); +/-20%
Minimum Line Width (Outer/Inner); (1 oz base Cu) 0.005″ (0.127); +/-20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (1 oz base Cu) 0.006″ (0.152); +/-20%
Minimum Line Width (Outer/Inner); (2 oz base Cu) 0.006″ (0.152); +/-20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (2 oz base Cu) 0.007″ (0.178); +/-20%
Minimum Line Width (Outer/Inner); (3 oz base Cu) 0.008″ (0.203); +/- 20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (3 oz base Cu) 0.009″ (0.228); +/-20%
Minimum Line Width (Outer/Inner); (4 oz base Cu) 0.011″ (0.279); +/- 20%
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (4 oz base Cu) 0.013″ (0.330); +/-20%

Silk Screen

Capabilities Attributes Extended Capabilities Inch (mm); Tolerance
Inkjet silk screen -
LPI legend capabilities Black, Yellow, Red, Blue
Minimum line width -
LPI Legend Min. Line -
Serialization/Bar code -
Silk screen clearance Copper pad -

Multilayer Capabilities

Capabilities Attributes Extended Capabilities Inch (mm)
Min. Thickness ( Inner Core) -
Min.Finish Line Width/Space -
Impedance Control L/W -
Non-Impedance Control L/W -
Min. Annular ring -
Min. Clearance -
Dielec-Thickness Tolerance(Impedance) -
Dielec-Thickness Tolerance(Non-Impedance) -
ML Board Thickness Tolerance -
Layer Registration (Core to Core) -
Warpage Tolerance -
Etch back Specification (Class 3) -
Internal Etch tolerance +/-20%
External Etch tolerance +/-20%
Layer to Layer Registration – (> 2 layer) -
Layer to Layer Registration – (2 layer) -
Maximum PWB Thickness (Mil) 210
Maximum Number of Layers 24
Profile Tolerance (Routed) +/- 0.004″ (0.1016)
Profile Tolerance (Scored) +/-0.005″ (0.127)
Minimum Internal Cut-out Radius 0.032″ (0.813)
Smallest BGA footprint pitch – inches (mm) 0.020″ (0.500)
I/L Copper to Board Edge (Routed) *2 0.007″ (0.178)
I/L Copper to Board Edge (Scored) *2 0.015″ (0.381)
O/L Copper to Board Edge (Routed) *2 0.005″ (0.127)
O/L Copper to Board Edge (Scored) *2 0.012″ (0.305)

Plating

Capabilities Attributes Extended Capabilities Inch (mm)
IPC-6012 Class 2 Yes
IPC-6012 Class 3 984 µin avg / 787µin min (Through holes)
Military (MIL-PRF-31032) 1000 µin min (Through holes)

Pad and Hole

Capabilities Attributes Extended Capabilities Inch (mm)
IPC-6012 Class 2 -
IPC-6012 Class 3 984 µin avg / 787µin min (Through holes)
Military (MIL-PRF-31032) 1000 µin min (Through holes)
Minimum Finished PTH Hole Size 0.005″ (0.127)
Minimum Space (Trace\Trace) & (Trace\Pad) (Outer/Inner) (1/4 oz base Cu) 0.005″ (0.127)
Component Finished PTH Size Tolerance +/- 0.002″; 0.004″ (0.102)
Press Fit application +/- 0.002″
Via Finished PTH Size Tolerance +/- 0.002″; 0.004″ (0.102)
PTH Locational Tolerance N/A
Internal Pad Size (Dia. over Drill) 0.008″ (0.203)
Internal Anti Size (Dia. over Drill) 0.012″ (0.305)
External Pad Size (Dia. over Drill) 0.006″ (0.152)

Drilling

Capabilities Attributes Extended Capabilities Inch (mm)
Smallest Mechanical Drill Size 0.006″ or less
Tolerance of Drill size
Roughness for hole wall
Neil Head
Drill Quality
Maximum Drill Aspect Ratio (w/ min. drill) 12:1
Maximum Micro via Aspect Ratio (Depth: Diameter)
Maximum Hole Size (Drilled)
Maximum Hole Size (Routed)
Thickness:
  • < 0.020″
  • 0.031″
  • 0.062″
  • 0.093″
  • 0.125″
NPTH Size Tolerance Range
NPTH Locational Tolerance
Non-Plated Hole to Outer Copper Minimum Spacing
Hole to Inner Copper Minimum Spacing
Non-Plated Hole to Edge (No Breakout)
Plated Hole to Edge (No Breakout)
Back Drilled Vias (High Speed Transitions) -
Blind/Buried Vias (All Types) Yes

HDI / Laser Micro Vias (10)

Capabilities Attributes Extended Capabilities Inch (mm)
Laser vias smallest 0.004″ (0.1016)
Via aspect ratio 1:1
Landing and capture Pad size via + 0.008″
Stack vias, Copper filled vias Yes
Laser Drilled Vias Yes (Outside service)

Control Depth Capabilities

Capabilities Attributes Extended Capabilities Inch (mm)
Drill depth Tolerance (Control Depth Drill Depth)
Back Drill Dia (Minimum) 0.014″
Drilled Hole over Finish (Dia)

Fabrication

Capabilities Attributes Extended Capabilities Inch (mm)
V-score
Offset Tolerance
Web Thickness Tolerance
Position Tolerance
Average Web Thickness
Minimum Web Thickness
Router Bit (Standard)
Router Tolerance (dia) +/-0.003″
Router Plated Slots 0.008″ (Min)
Router Radius (Min) 0.0105″

Bevel Capabilities

Capabilities Attributes Extended Capabilities Inch (mm)
Bevel Angles ; Depth Tolerance

Solder Mask

Capabilities Attributes Extended Capabilities Inch (mm)
Min. Solder Mask Dam (Green) 0.003″ (0.076)
Registration (+/-) per side 0.0025″
Mask to Copper clearance Min. 0.002″ (LDI)
Peelable Solder mask Min. 0.040″
Solder mask Via plug w/LPI
NPTH holes/side
Min. Mask defined pad diameter
Carbon Link Yes
Solder mask Colors Any custom color
Solder mask using Laser Direct Image Yes
Non-Conductive Epoxy Via Fill (3) Yes
Conductive Via Fill (10) Yes

Impedance (Adder)

Capabilities Attributes Extended Capabilities Inch (mm)
Single ended; Differential Edge-coupled ; Differential Broadside-Coupled
Inhouse testing

Materials

Capabilities Attributes Extended Capabilities Inch (mm)
Minimum Dielectric Thickness 0.0025″ (0.064)
Minimum Copper Weight – Inner Layers (oz) 0.25
Minimum Starting Copper Weight – Outer Layers (oz) 0.25
Maximum Copper Weight – Inner Layers (oz) 4
Maximum Starting Copper Weight – Outer Layers (oz) 5
Epoxy Glass (140C Tg min) Yes
Epoxy Glass (170C Tg min) Yes
Polyimide Glass (9) Yes
Resin Coated Copper (for HDI) N/A
GeTek (9) No
Isola 408 / Isola 408HR Yes
Isola ISpeed(9) / Isola ITera (9) Yes
Hitachi GHA-679G (Theta) (9) Yes
Rogers(9) 4003/4403 Rogers(9) 4350B/4450B Rogers(9) 4533 Yes
Teflons(9) (Rogers 6002, 6010, 5880) Halogen Free Epoxies(9) Yes
Buried Capacitance (Faradflex) Yes
Aluminum MCB Yes

Multilayer Stackup Tolerances

Capabilities Attributes Extended Capabilities Inch (mm)
Thickness:
  • <0.020″”
  • 0.031″”
  • 0.062″”
  • 0.093″”
  • 0.125″”

Surface Finishes (Adder)

Capabilities Attributes Extended Capabilities Inch (mm)
Lead-free HASL; HASL (10)
Electroless Nickel Immersion Gold (ENIG)
Eless Nickel Eless Palladium Imm Gold (ENEPIG) (10)
Hard Gold (10)
Hard Gold (Tabs)
Soft Bondable Gold (10)
Immersion Silver
Mix Finishes (ENIG and Soft Gold)

Multiple Finishes (Adder)

Capabilities Attributes Extended Capabilities Inch (mm)
HASL with selective gold Yes
ENIG w/ Au fingers Yes
Recessed Fingers Yes

Electrical Test Capabilities

Capabilities Attributes Extended Capabilities Inch (mm)
TDR Test Tolerances 0.05
HiPot Test (AC/DC) (10)
Min. Test Continuity
Max. Test Voltage
Max. Test Isolated resistance
Fixture (Pad size)
Flying Probe (pad size:) 0.008″

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