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DIRECT THERMAL EXCHANGE

Direct Thermal Exchange (DTE) is a new PCB construction methodology that has been developed to achieve highly-efficient heat removal or thermal dissipation. This paper presents Direct Thermal Exchange (DTE) as a technology solution to the current limitations of thermally conductive dielectric when used in thermal management (heat dissipative) designs for high-power circuits (LED, Wireless, Microwave) in Printed Circuit Board (PCB) designs.


  • DTE Brochure

    No design changes required, Avoid LED “thermal runaway”, Increases system's working life, Increased efficiency at low cost.

  • Thermal Issue

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  • Introduction

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  • Capabilities

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  • Advantages

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  • Comparison of DTE vs FR4

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  • White Paper

    As the name implies, DTE is a ‘direct’ thermal transfer method when high amounts of thermal energy must be removed quickly and consistently from a heat- generating device. DTE was developed primarily to address thermal problems posed by the development of high power LEDs with demanding thermal performance, although it can be used in many other applications.