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Design Guidelines: White Solder Mask

Design Guidelines: White Solder Mask
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Design Guidelines: White Solder Mask

 

Summary :
White solder masks do not have the ability to resolve small features the way conventional Green or even Blue or Red solder masks do. This is because of the very high pigment loading involved with creating a White LPI solder mask. In order to achieve a Bright White solder mask which will resist yellowing, large quantities of special white pigments are used in the formulations.

Design Guidelines: White Solder Mask

White solder masks do not have the ability to resolve small features the way conventional Green or even Blue or Red solder masks do. This is because of the very high pigment loading involved with creating a White LPI solder mask. In order to achieve a Bright White solder mask which will resist yellowing, large quantities of special white pigments are used in the formulations.

These same white pigments also restrict the transmission of UV light used when imaging the features in the solder mask so that less UV energy actually reaches the base of the solder mask coating. This restriction in UV energy also restricts the size of the features that a White solder mask can reproduce. A thick coating, often associated with today’s high copper design panels, will compound the issue as the UV light has to travel a greater distance to the base of the coating.

White solder masks will resolve a 5-6 mil feature under the best conditions because of the reduction in UV light, and if the White coating is thicker due to the panel design, the smallest feature you can hold will be even wider than 5-6 mils.

For more info contact us at design@eiconnect.com or call our engineering department: 800-364-4844

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