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EI UL Approval for New High Thermal Performance PCB Products

Date Posted : 01/24/2011

Source : Press Release

Chicago, Illinois, USA – Electronic Interconnect (EI), a leading provider of printed circuit boards (PCBs) and PCB engineering and design services, has received Underwriter’s Laboratories (UL) approval to use 6-ounce copper and metal clad PCB components in PCB products and to apply the UL approval mark to them. EI received a UL Notice of Authorization to apply the UL Mark to PCB products using Tlam™ SS LLD thermally conductive PCB substrate, a low-cost, high-performance thermal substrate system specifically designed for LED module applications. Tlam SS LLD is a trademark of Laird Technologies, Inc., headquartered in St. Louis.

“This authorization by UL is recognition of the competence and quality built into every EI PCB,” stated Alexander Nudelman, EI’s Quality Assurance Manager. “UL evaluated our newer, higher- performance products and found them worthy once again to bear the UL Mark. This is an important step for us, because EI has been a leader in the design and fabrication of thermal management boards. We offer a wide range of PCB materials, constructions, and configurations for electronic assemblies requiring heat management characteristics, such as high-power devices, RF and wireless, lighting and LED boards, and others.”