• Customer  | 
  • +1 (800) 364-4844 sales@eiconnect.com
  • Follow Us

IPC Netlist Comparison

IPC Netlist Comparison
Enlarge
IPC Netlist Comparison

 

Summary :
Most Design software have the ability to export out not only Gerber data for fabrication, but also Netlist information. This Netlist is exported out in the popular IPC-365-A format.
Most Design software have the ability to export out not only Gerber data for fabrication, but also Netlist information. This Netlist is exported out in the popular IPC-365-A format.

Through our years of experience, we highly recommend asking your board-shop if they have the ability to compare your Gerber data with an IPC Netlist. This comparison ensures that the Gerber data matches the Netlist in your CAD software, avoiding any surprises that may have been caused through export issues or import issues from the fabrication shops CAM software. In the end, this provides an excellent reliability check so that corrections can be made and precious time is not wasted in extra design revisions.

Electronic Interconnect offers full IPC-365-A Netlist comparison support. For further information, you can contact us at Engineering@eiconnect.com!
Disclaimer:
Articles on this website are provided for information purposes only. This article and its content and images is copyright of electronic interconnect. All rights reserved. Any redistribution or reproduction of part or all of the contents in any form is prohibited.

You may not distribute or commercially exploit the content. Nor may you transmit it or store it in any other website or other form of electronic retrieval system.



Related Tech articles:

 
IPC-1601, Standard on Handling, Packaging and Stor
IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake. The document covers all phases of production, from the manufacture of the bare printed board, through delivery, receiving, stocking, and soldering. It also gives needed attention to helping users with moisture concerns. The following information provides guidance on establishing recommended moisture levels and baking profiles for moisture removal, and covers the impact of baking on printed board solderability. Moisture absorbed in printed board laminates expands at soldering temperatures, and in some cases the resulting vapor pressure can cause internal delamination or excessive strain on plated-hole walls and other structures. Read more

Read More Tech articles:

Electrical Testing [1]
 
IPC Standard [2]
 
Metal PCB [2]
 
PCB Design [2]
 
PCB Materials [1]
 
PCB Technology [9]
 
Proto Print Stencils [1]
 
RF PCB [2]