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Typical PCB Manufacturing Process Flow Chart

PCB Manufacturing Process - Flow Chart – PCB Fabrication Process

The PCB fabrication process can be complex. To explain the PCB manufacturing process at Electronic Interconnect, we are including 3 flow charts that highlight the PCB process.

The PCB fabrication process can be complex and confusing. Electronic Interconnect manufactures single-, double- and multilayer circuit boards. To help explain the PCB process Electronic Interconnect uses we are including three flow charts, which highlight the process your PCBs follow from the earliest step of pre-production engineering until your PCB is complete and shipped out our doors. We offer affordable quick turn PCB fabrication services. Learn more about our full range of PCB layout services.

Typical Flow Chart For Single Sided Boards

PRE PROD ENGINEERING --> CAD/CAM AND  DRILL PROGRAM --> SHEARING --> DRILLING --> DEBURRING
v
PREMASK INSPECTION  --> RESIST STRIPPING --> ETCHING  --> OUTERLAYER IMAGE --> SCRUBBING
v
SCRUBBING  --> LPI SCREENING  --> TACK DRYING  --> LPI IMAGE  --> LPI FINAL BAKING 
v
ELECTRICAL TESTING --> FABRICATION --> SILK SCREEN (LEGEND)  --> HOT AIR SOLDER LEVELLING INSPECTION  --> HOT AIR SOLDER LEVELLING 
v
FINAL INSPECTION --> FINAL AUDIT --> SHIPPING 
 

Typical Flow Chart For Double Sided Boards


PRE PROD ENGINEERING --> CAD/CAM AND DRILL PROGRAM --> SHEARING --> DRILLING --> DEBURRING
v
COPPER PLATTING --> OUTER LAYER IMAGE --> SCRUBBING --> ELECTROLESS COPPER --> DESMEAR
v
TIN PLATING --> RESIST STRIPPING --> ETCHING --> TIN STRIPPING --> PREMASK INSPECTION
v
LPI FINAL BAKING --> LPI IMAGE --> TACK DRYING --> LPI SCREENING --> SCRUBBING
v
HOT AIR SOLDER LEVEL --> HOT AIR SOLDER LEVELLING  INSPECTION --> SILK SCREEN (LEGEND) --> FABRICATION --> ELECTRICAL TESTING
v
SHIPPING --> FINAL AUDIT --> FINAL INSPECTION
 

Typical Flow Chart For Multilayer Circuit Boards


PRE PROD ENGINEERING --> CAD/CAM AND DRILL PROGRAM --> SHEARING --> INNER LAYER IMAGE -->  INNERLAYER ETCHING
v
MULTI LAYER LAY-UP --> INNER LAYER PUNCH --> BLACK OXIDE --> INNER LAYER INSPECTION --> RESIST STRIPPING
v
MULTI LAYER PRESSING --> SHEARING AND BEVELLING --> DRILLING --> DEBURRING --> DESMEAR
v
TIN PLATING --> COPPER PLATING --> OUTER LAYER IMAGE --> SCRUBBING --> ELECTROLESS COPPER
v
RESIST STRIPPING --> ETCHING --> TIN STRIPPING --> PREMASK INSPECTION --> SCRUBBING
v
HOT AIR LEVEL SOLDER LEVELLING --> LPI FINAL BAKING --> LPI IMAGE --> TACK DRYING --> LPI SCREENING
v
HOT AIR SOLDER LEVELLING INSPECTION --> SILK SCREEN (LEGEND) --> FABRICATION --> ELECTRICAL TESTING --> FINAL INSPECTION
v
SHIPPING --> FINAL AUDIT
 

Types of Processes


CHEMICAL AND MECHANICAL THERMO MECHANICAL PHOTO
CHEMICAL SCREENING INSPECTION OTHER
 

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