PCB Manufacturing | Circuit Board Manufacturing

EIconnect PCB Manufacturing Capabilities :

Electronic Interconnect is a full service printed circuit board manufacturer. Below is a chart outlining EI’s PCB manufacturing capabilities. For definitions of terms or for more information, go to our PCB Glossary For delivery information, visit our delivery/shipping information section . EI accepts PCB files in Gerber 274X file format with ASCII NC drill files. All files should be sent in a zip-format and sending a readme file is recommended : We are a circuit board manufacturer(ISO 9001-2000 certified) specilizing in high quality PCB prototype and production with quick turnaround. Obtain an Instant Quote also download our Capabilities Brochures.

Specifications	Details
Material Type	FR-4, FR-TG170, FR-TG180, CEM-1, CEM-3, Metal Clad (Al, Cu), Flex, Arlon, Duroid, Rogers, Polyimide, Kapton
Material Thickness ( in inches)	0.062”, 0.080”, 0.093”, 0.125”, 0.220”, 0.047”, 0.031”, 0.020”, 0.005"
Layer count	1 to 22 Layers
Max. Board Size	21 * 28
IPC Class	Class II, Class III , Class 1
Annular Ring	5 mil/side or Greater (Min. Design)
Finish Plating	Leaded Solder(HASL), Lead Free Solder(HASL), ENIG (ELectroless Nickel Immersion Gold), OSP, Immersion Silver, Immersion Tin, Immersion Nickel, Hard Gold, Hard Nickel and Other
Copper Weight	Outer : Up to 8 oz, Inner : up to 6 oz
Trace/Space Width	5/5 mils or Greater
Drill Clearance	0.012”
Plated Slots	0.036 or Greater
Aspect Ratio	10
Gold Fingers	1 to 4 Edge (30 to 50 Micron Gold)
SMD Pitch	0.080” - 0.020” - 0.010”
Soldermask Type	LPI Glossy, LPI-Matte
Soldermask Color	Green, Red, Blue, Black, White, Yellow, Clear and Custom Color
Legend Color	White, Yellow, Black, Red, Blue and Custom Color
Minimum Route Width	0.025”
Scoring	Straight Lines, Jump Scoring, Panel Edge to Edge, CNC*
Data File Format	Gerber 274x with embedder aperture
Fab. Drawing Format	DXF, HPGL, DWG, PDF, Gerber
E.T Testing	Flying Probe, Single Sided, Double Sided, Net List
Counter Sink / Counter Bore	Availiable up to 0.250 Diameter
Control Impedence	With Limited Tolerance Capabilities
Blind Vias / Buried Vias	Yes With Limited Capabilities
Peelable Mask	Yes
Carbon	Yes

PCB Thermal Management Materials and Constructions

These printed circuit board (PCB) materials, constructions, and configurations for electronic assemblies requiring heat management characteristics (high-power devices, RF and wireless, lighting/LED boards, etc.) are UL-certified metal-clad PCBs with a standard dielectric, and can work with various thicknesses of aluminum and copper metal cores. Precise machining tolerances and high-quality fabrication services enhance thermal management and long-term board reliability. The T-lam thermal lamination system, which includes T-Preg thermally conductive dielectric/ Prepreg, DSL or double-sided metal core laminate is offered, as well as insulated metal printed circuit boards (IMPCBs). Other constructions include 2-layer T-lam, hybrid IMPCBs with FR-4/T-preg, multilayer metal base construction, and multilayer FR-4/T-preg hybrids. Design counseling services support the PCB program. The materials used feature good thermal performance with high dielectric strength and low capacitance; and can eliminate the need for fans, heatsinks, and heat spreaders.