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Metal PCB capabilities

  Description
Layer1- 6 Layers ; Hybrid constructions with FR4; Other constructions available
Material Aluminum / Copper Based
Manufacturer Bergquist (USA); Laird Technology, CSEM, Aismalibar; Ventek, Dupont,
Copper Thickness 0.5 oz- 6 oz
Final Thickness 0.02" - 0.18" (0.5mm- 4.6mm) tg130° - tg170°
Surface Treatment Regular Lead: HASL; Lead- free: Lead- free HASL, ENG Gold; OSP, Immersion silver
Min/Max Board Size Min: 0.5"x0.5" Max: 34”x22”"
Min Trace width/Min
Clearance
0.5oz – 2 oz.: 5/5 mil
3 oz: 7/7mil
4 oz.- 6 oz : 10/10mil
Min Hole Ring (NPTH)0.5 oz – 6 oz.: 8 mil/side ;
Min Hole Ring (PTH)0.5 oz – 6 oz: 7 mil/side
Min Hole size and ToleranceMin hole: 30mil (Final Thickness 0.5mm- 2.0mm)
45mil (Final Thickness 2.0mm- 4.6mm)
Tolerance: PTH±4mil, NPTH±3mil ( FR4 construction only)
Thickness of Plating LayerHASL: Avg. 100 u”
Immersion Gold: Nickel: 100u"- 200 u"; Gold: 2u"- 4u"
Immersion Silver: 6u"- 12u"
OSP: Film 8u"- 20u"
Solder Mask ColorSemi Gloss: Green, Black, Red, Yellow, White, Blue
Solder Mask Thickness: 0.2mil- 1.2mil
Solder Mask Resolution Solder Dam: Green(2 oz ): 4mil
Other Color” 5mil
Solder Mask Hole Plug Diameter: Not Available
Silk Screen ColorWhite, Black
Silk Screen SizeMin Width: 6mil; Height: 32mil
Testing VoltageTesting Fixture: 50V- 300V     Flying Probe: 30V- 250V
Profile
CNC Tol: ± 10mil (std); 5 mil (optional) Slot Min: 62 mil (std); 40mil (Optional)
V- CUT Tol: ±5mil Angel: 30°
Bow and Twist≤1%
Accept StandardIPC Class 2; IPC Class 3; ISO9000